For the deposition DNTT on crystalline surface, in this case Ag(111), Ag sputtering deposited on Mica is used.
Before the deposition, here is Ag/Mica preparation procedure.
Ag/Mica substrate Preperation
- Heating up to 550K. Slow heating rate -> 0.1 K/s
Mica contains moisture. we need to evaporate the water. As slow heating the substrate, we avoid dramatic water expansion which can crush Mica. (slowly desorb water out of Mica)
- Sputtering @800V for 15min, Heating at 600K
Manual heating to 600K
Adjust : Spannung 215V, Fila-strom, 1.80A /
not Adjust Strom 1.40A,
To make clean and smoother surface.
- Sputtering @800V for 15min, Heating at 730K
- Sputtering @800V for 15min, Heating at 730K (one more time)